Open Compute
product line

OCP technology, available with Intel Xeon SPR/EMR and AMD EPYC processors, enables workloads to be deployed in a high-availability scheme at low cost.

OCP technology offers benefits related to energy efficiency (lower OPEX), and high density (lower CAPEX) with a simple level of operation where parts can be changed without shutting down or completely removing the server.

In the case of Intel 4th Gen SP processors, there are servers with 1 open unit (48mm) with 2 sockets, memory capacity of up to 8TB, 8 channels per CPU, PCIe Gen.5×16 slots and PCIe Gen.5×16 OCP v3.0 mezzanine slot, up to 4 bays for E1.S Gen4/5 SSD drives and an additional M.2 type.

 Our solution for AMD EPYC Genoa/Bergamo processors includes sleds that can accommodate a 2 open unit chassis (up to 3) and a standard 4.5 rack unit chassis (up to 4), with 1 socket, memory capacity up to 4TB with 8 channels, PCIe Gen.5×16 slots and PCIe Gen.5×16 OCP v3.0 mezzanine slot, up to 4 bays for E1.S Gen4/5 SSD drives and 2 additional M.2 type.

We have a server line for the edge (Edge) and MEC that comply with the NEBS-L3 standard, designed to support workloads that need to be deployed as close as possible to the end customer. The common applications are MEC (AI, ML, DL), openRAN (CU,DU), 5G Core, UPF and Edge computing.

Edge server line with 1 socket and 1 rack unit (RU)

A server designed to work in indoor (-5º ~ 55º) and outdoor (-40º ~ 65º) environments with a very compact footprint. Usually used for workloads of openRAN, such as CU and DU (including IEEE1588 time sync & SyncE, FEC and GPS).

It supports an Intel Xeon SP SPR/SPR-EE, ICX Lake, 6338N and 5318N processor, up to 2TB of RAM, PCIe Gen 4×16 cards, and storage support using M.2 2280/22110 SATA/NVMe. Includes FEC hardware acceleration for 5G RAN FH Layer1.

Edge server line with 1 socket, 2 rack units (RU) and 3 sleds

A server designed to work in indoor (-5º ~ 55º) environments with a 2 RU chassis that allows the installation of up to 3 servers. Ideal for deploying MEC (AI, ML, DL), CU & DU applications all-in-one and edge computing.

Each sled (server) supports an Intel Xeon SP ICX Lake processor, up to 2TB of RAM and storage using M.2 2280/22110 SATA/NVMe.

It supports an Intel Xeon SP SPR/SPR-EE, ICX Lake, 6338N and 5318N processor, up to 2TB of RAM, PCIe Gen 4×16 cards, and storage support using M.2 2280/22110 SATA/NVMe. Includes FEC hardware acceleration for 5G RAN FH Layer1

Edge server line with 2 sockets and 2 rack units (RU)

A server designed to work in indoor (-5º ~ 55º) environments. Usually used for MEC (AI, ML, DL), 5G Core, UPF applications and Edge computing. Its dimensions are 450mm x 439mm x 89mm.

It supports an Intel Xeon SP processor, up to 2TB of RAM, PCIe Gen4x16, PCIe Gen4x8 and PCIe Gen3x16 OCP 2.0 cards. Storage support using 2.5” NVMe/SATA/SAS and M.2.

For the software-defined storage (SDS) line, an architecture where standard control servers and equipment with disk arrays are deployed which allow a rapid expansion of capacity according to the storage needs is proposed.

JBODs or disk arrays allow the deployment of capacities of up to 60 SSD drives (460TB raw) for each array, which can grow vertically increasing the total capacity of the system. The control servers can work with AMD or Intel processors with a lower capacity of cores and memory than a computing server. The cluster capacity can grow in a vertical form quickly while maintaining investment efficiency.

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